Microtechnology/Additive Processes

=Additive Processes= Processes where material is added to the wafer.

=Overview=

=Oxidation=

Oxidation in microtechnology refers most often to the oxidation of silicon. A layer of silicon dioxide created on the surface of a silicon wafer can be easily patterned. An SiO2 layer can be created by thermal oxidation or by deposition.

=Chemical Vapor Deposition (CVD)=
 * Chemical vapor deposition and plasma enhanced CVD

=Physical Vapor Deposition (PVD)=
 * Physical vapor deposition (PVD)

Sputter Deposition

 * sputtering
 * Thin-film deposition



Electron Beam Evaporation Coating

 * Electron Beam Evaporation Coating

=Epitaxial Growth=
 * Metal Organic Vapor Phase Epitaxy (MOVPE)
 * Molecular beam epitaxy (MBE) using solid sources and Chemical beam epitaxy (CBE) using gasseuos sources.
 * Epitaxy in general.
 * Atomic layer epitaxy where only a few monolayers are deposited and bond to chemisorption sites on the surface.

=Electrochemical Methods=

Electroplating

 * Electroplating
 * list of standard reaction potentials standard reduction potentials

Electroless depositions

 * Electroless nickel plating
 * Electrochemical deposition of metals onto silicon
 * Y. Okinaka, in Electroless Plating: Fundamentals and Applications, edited by Glenn O. Mallory and Juan B. Hajdu, Chapter 15, American Electroplaters and Surface Finishers Society (1990).

=Spinning= Photo and electron beam resists as well as many other polymers are often coated on wafers by spinning a volatile solution of the compound onto the wafer.

=Surface Functionalization=
 * Self-assembled monolayers (SAM)
 * Hydrophobe and Hydrophile surface layers to control wetting.

=References=

See also notes on editing this book about how to add references Microtechnology/About.