Microtechnology/Additional Methods

Additional Methods
Apart from additiev and etching processes, there is also a range of processes to alter the materials properties and to characterize them.

Rapid Thermal Anneal (RTA)

 * Rapid thermal anneal (RTA)

Wafer Bonding
Wafer bonding Wafer bond characterization
 * Direct bonding
 * Plasma activated bonding
 * Anodic bonding
 * Eutectic bonding
 * Glass frit bonding
 * Adhesive bonding
 * Thermocompression bonding
 * Reactive bonding

Doping

 * Dopant

Ion Implantation

 * Ion Implantation

Interconnections

 * Wire bonding
 * Flip chip bonding
 * Wedge bonding
 * Using ZIF sockets

Encapsulation

 * Silicone oil
 * Spray-on polymers

Glues

 * Epo-tek H77 is a common packaging two-component UHV compatible epoxy glue.
 * Fortafix makes a high temperature glue that should work up to around 1000 C called Rocksett.
 * Vitcas Refractories manufacturer of high temperature glue/adhesives for industrial and domestic use up to 1700 C

Ellipsometry
Ellipsometers are used to measure thin film thicknesses by their optical properties (refractive index and reflectivity/absorbance).

4 Point Measurements
The four-point probe technique can be used to measure the conductivity of thin films. For improved measurements micro four-point probes can be used. Capres has an application note about micro four-point probes.

Atomic Force Microscopy
The Atomic force microscope (AFM) is mainly used to measure the topography of a surface, such as the roughness.

Scanning Electron Microscopy
JEOL has a good guide to SEM image interpretation

Optical Microscopy
Theres a good introduction to optical microscopy from Zeiss.

Vacuum Equipment

 * mass flow controllers (MFC) Gas conversion factors and formulas for calculating them